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hDD Hybrid Diamond Dressers
Meister Abrasives Unveils New Hybrid Diamond Dressing Technology
Grinding wheels perform consistently better;Dressing tools never require conditioning.



HYBRID Bonding Technology
Meister Abrasives USA will be introducing two new product lines this year based
on an advanced bonding technology that provides the durability of a metal
bond along with the free-cutting porosity of vitrified products.

Advanced Vitrified Bonding Technology Has Wheel Life and Performance Advantages
North Kingstown, RI- Vitrified bonds are the most recently developed and advanced bonding systems for superabrasive grinding wheels. A new HPB high performance bonding technology has been developed by Meister Abrasives! This technology improves vitrified bonding to manufacture grinding wheels that last significantly longer, cut faster or both!!

Unique External Superabrasive Wheels
Delivering Lower Cost Per Part
North Kingstown, RI- A growing number of new external/OD grinding machine systems are being designed to take advantage of superabrasives. Meister Abrasives USA, well known for its expertise in internal bore grinding, has also developed a line of external products in parallel with this trend to maximize grinding performance and minimize costs.



NEW Meister HPB Technology
North Kingstown, RI--After several years of research and development, Meister Abrasives has introduced new HPB (High Preformance Bonding) technology capable of making vitrifited CBN grinding whels that can decrease grinding cycles by up to 25% and improve wheel life by up to 100%. This technology is fully commercial and grinding wheels manufactured by this process are available from Meister Abrasives USA.

Single crystal c-plane sapphire wafers
Single crystal sapphire is widely used to fabricate optical windows and laser components. As the technology leader in the manufacture of vitrified super abrasives, Meister Abrasives has undertaken process trials and developed a new innovative range of vitrified diamond super abrasives that enbles coarse and fine grinding of sapphine wafers. 



Thinning of Silicon Carbide Substrates
Silicon Carbide is one of the most useful of the wide band gap semiconductor materials. Meister Abrasives has developed a new range of vitrified diamond super abrasives that enable fine grinding of very thin Silicon Carbide substrates down to 100 microns or less.

Innovative flat honing with vitrified-bond grinding and conditioning tools
The flat honing process has long been established for the high-precision machining of ceramic, metal and polymer components when the very highest degrees of planeparallelism are required.
by Dr.-Ing. Peter Beyer and Marc v. Ravenzwaaij, published in the April 2005 edition of the Professional Magazine "Industrial Diamond Review"

vDD Technology for Vitrified Bond Diamond Dressers
The contribution made by the grinding tool supplier is not limited only to the grinding tool itself, but can be significantly influenced by the selection and development of a matching dressing tool for conditioning.
by Dr.-Ing. Peter Beyer, published in edition I/05, January 2005 of the Professional Magazine "Industrial Diamond Review"

 HPB Technology for Vit CBN Grinding Tools
The development of HPB for vitrified bond grinding wheels is a very promising concept with potential for achieving significant productivity improvements for the user.
by Dr.-Ing. Peter Beyer, published in edition IV/04, November 2004 of the Professional Magazine "Industrial Diamond Review"