HomeProductsCompanyDownloadsContact Us!Printer friendly versionSitemapSearch
     
Section
Wafer Grinding




Component
Component: Wafer
Dimensions: Ø 2" - 12"
Material: Si, SiC, Sapphire (C-, A- and R-Plane), GaAs, GaN, etc.



Grinding Machine
Machine: Disco, Supfina, Okamoto, Strasbaugh, G&N, etc.
Grinding Op: thinning (rough- and fine grinding), backgrinding, reclaim grinding



Grinding Tool
Grinding Tool: rough grinding: 325 - 550 mesh
fine grinding: up to 8500 mesh



Results
Surface Finish Achieved: Ra 0.4 - Ra 0.015, depending on tool specification
Geometry Tolerances Achieved: TTV <2µm


We are pleased if we can help to solve your grinding problem


Fill out the Semiconductor Application Questionnaire
(a new window opens)


Or directly contact our specialist for Semiconductor Applications

 Case Studies
Internal Grinding Internal Grinding Internal Grinding
External Grinding External Grinding External Grinding
Face Grinding Face Grinding Face Grinding
Gear Gear GearGear
PCD Tool PCD Tool PCD ToolPCD Tool
Wafer Grinding Wafer Grinding Wafer GrindingWafer Grinding
Lapping/Fine-Grinding Lapping/Fine-Grinding Lapping/Fine-Grinding
Centerless Grinding Centerless Grinding Centerless Grinding
JIG Grinding JIG Grinding JIG Grinding


Wheels

Quills

Dressing Tools and Spindles

Governing Factors

Grinding Wheel Calculations


[ Extended Search ]
You are here:
Home / Products / Case Studies / Face Grinding / Wafer Grinding 		Last Update: 03-03-2010
© 2010 by Meister Abrasives. All rights reserved.
 Privacy Statement