201 Circuit Drive
North Kingstown, RI 02852
Fon: +1 401-294-2530
Toll- Free: 1-888-Meister
Fax: +1 401-294-7326
| Meister Grinding Technologies
Corp. - USA 201 Circuit Drive North Kingstown, RI 02852 Fon: +1 401-294-2530 Toll- Free: 1-888-Meister Fax: +1 401-294-7326 |
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| Adress: | http://www.meister-abrasives-usa.com/products/case_studies/face_grinding/wafer_grinding3 |
| Print Date: | 10-09-2010 |
| Last Update: | 27-02-2006 |
| Description: | |
| Wafer Grinding |
Component |
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| Component: | Wafer | |
| Dimensions: | Ø 2" - 12" | |
| Material: | Si, SiC, Sapphire (C-, A- and R-Plane), GaAs, GaN, etc. | |
Grinding Machine |
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| Machine: | Disco, Supfina, Okamoto, Strasbaugh, G&N, etc. | |
| Grinding Op: | thinning (rough- and fine grinding), backgrinding, reclaim grinding | |
Grinding Tool |
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| Grinding Tool: | rough grinding: 325 - 550 mesh fine grinding: up to 8500 mesh |
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Results |
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| Surface Finish Achieved: | Ra 0.4 - Ra 0.015, depending on tool specification | |
| Geometry Tolerances Achieved: | TTV <2µm | |
We are pleased if we can help to solve your grinding problem | |
 | Fill out the Semiconductor Application Questionnaire (a new window opens) |
| Or directly contact our specialist for Semiconductor Applications |